Non-destructive damage evaluation of composite structures by optoelectronic holography methodologies

Demands for increased performance and efficiency of mechanical and electromechanical components impose challenges on their engineering design and optimization, as well as on the types of materials utilized in their construction. Demands on materials imposed by new and rigorous applications have become so diverse and severe that single-component materials used alone cannot meet them. It is frequently necessary to combine two or more distinct materials into a composite to define a new material with enhanced properties. In this paper, nondestructive, noninvasive, and full-field-of-view optoelectronic holography (OEH) methodologies are applied to experimentally determine material properties and to perform damage evaluation in composite materials. Specifically, high-performance glass reinforced epoxy laminates utilized in electronic packaging applications are investigated. Analytical, computational, and experimental solution (ACES) methodology is applied in the studies. With ACES, orthotropic material properties of the composite laminates are determined with a maximum uncertainty on the order of 5% and deformation measurement accuracy on the order of 5 nm are achieved, which allows us to successfully identify delamination defects.